How Facebook flipped the data centre hardware market | The Register

Jack Clark; How Facebook flipped the data centre hardware market; In The Register; 2014-02-20.
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Open Compute Project (OCP)

 Open Compute Project

Desgns & Projects

  • Specification: facebook/opencompute
  • Open Rack; circa 2012-05-02
    • Facebook – Knox storage server “vanity free”
    • AMD – Roadrunner
    • Intel – Decathlete
    • Tencent & Baidu – Project Scorpio
    • HP – “Project Coyote” server
    • Dell “Zeus” storage
  • Contributed by Facebook
    • Open Vault
    • Dragon Stone
    • Winterfell
  • Group Hug board
  • OCP Solutions Provider

Events

Who

Mentions

  • Founded 2011-Q2 (spring)
  • A foundation for governance
  • Partners
  • Backers (different than “partners” … purely financial?)
    • Rackspace
    • Goldman Sacks
    • Fidelity
    • Dell
    • Intel
    • AMD
  • Members
    • EMC
    • Fusion-io
    • Hitachi
    • Applied Micro
    • ARM
    • Sandisk
    • 50 organizations are part of the project, Frankovsky says.
    • elsewhere: HP, AMD, Fidelity, Quanta, Tencent, Salesforce.com, VMware, Canonical, DDN, Vantage, ZT Systems, Avnet, Alibaba, Supermicro, and Cloudscaling cite
    • HP, AMD, Fidelity, Quanta, Tencent, Salesforce.com, VMware, Canonical, DDN, Vantage, ZT Systems, Avnet, Alibaba, Supermicro, and Cloudscaling. HP, Quanta, and Tencent have taken the additional step of joining the OCP Incubation Committee cite
    • Avnet is investing in Open Compute labs. cite
    • Quanta has launched a new business called QCT where they are bringing new Open Compute technology directly to end users. cite
  • OpenCompute Group on Facebook

Concept

  • Standardized motherboard (socket) for Intel and AMD processors
  • “Group Hug Slot” (a motherboard specification)
    • Intel, AMD and Applied Micro support for x86 (x86_64)
    • Calxeda support for ARM processors.
    • Intel something about a motherboard based on (its) “silicon photonics technology.

Unclear

Mentions separately and elsewhere

  • Rumors (cite) that Intel is moving to a socket-free motherboard; where the processor is soldered directly onto the board with a factory-only BGA bonding process.
  • Rumors that Hewlett-Packard, and to an extent, Dell, which “manufacture” PCs

Promotions

Actualities

New OCP Technologies for Summit IV